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| NCP3712ASNT1 Over Voltage Protected High Side Switch This switch is primarily intended to protect loads from transients by isolating the load from the transient energy rather than absorbing it. Features http://onsemi.com MARKING DIAGRAM * Capable of Switching Loads of up to 200 mA without External * * * * * * * * * * * * * * Rboost Switch Shuts Off in Response to an Over Voltage Input Transient Features Active Turn Off for Fast Input Transient Protection Flexible Over Voltage Protection Threshold Set with External Zener Automatic Recovery after Transient Decays Below Threshold Withstands Input Transients up to 105 V Peak Guaranteed Off State with Enbl Input ESD Resistant in Accordance with the 2000 V Human Body Model Extremely Low Saturation Voltage Pb-Free Packages are Available 1 TSOP-6 CASE 318G BAGAYW G G 1 Applications Include: BAG = Device Code A = Assembly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) High Voltage Transient Isolation Power Switching to Electronic Modules DC Power Distribution in Line Operated Equipment Buffering Sensitive Circuits from Poorly Regulated Power Supplies Pre-conditioning of Voltage Regulator Input Voltage INTERNAL CIRCUIT DIAGRAM/ PIN CONFIGURATION Vin Q2 (5) R2 R4 Q1 (6) Vout Vin Vout N.C. Rboost (3) R1 R3 Rboost NCP3712ASNT1 (2) + P. S. - VZ Ropt Enbl or 1 k (min) L O A D (4) VZ (1) Enbl ORDERING INFORMATION Device NCP3712ASNT1 NCP3712ASNT1G Package TSOP-6 TSOP-6 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel SW Figure 1. Typical Application Circuit NCP3712ASNT3 NCP3712ASNT3G TSOP-6 10,000/Tape & Reel TSOP-6 10,000/Tape & Reel (Pb-Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2006 1 April, 2006 - Rev. 4 Publication Order Number: NCP3712ASNT1/D NCP3712ASNT1 MAXIMUM RATINGS (TJ = 25C unless otherwise noted) (Note 1) Rating Input-to-Output Voltage Reverse Input-to-Vz. Voltage Reverse Input-to-Rboost Voltage Output Load Current - Continuous Enbl Input Current - Continuous Vz Input Current - Continuous Rboost Input Current - Continuous Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Device Power Dissipation (Minimum Footprint) Derate Above 25C Latchup Performance: Positive Negative Symbol Vio Vin(rev) Vin(rev) Iload Ienbl Iz Iboost TJ TA Tstg PD - ILatchup Value 105 -9.0 -5.0 -300 5.0 3.0 10 125 -40 to +85 -65 to +150 300 2.4 200 200 Unit V V V mA mA mA mA C C C mW mW/C mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device contains ESD protection and exceeds the following tests: Human Body Model 1500 V per MIL-STD-883, Method 3015. Machine Model Method 150 V. A+ 1N4004 0.01 mF TYP FB* 0.027 mF TYP 18 V TYP R opt Ienbl Enbl 1 N.C. NCP3712 ASNT1 Vout 6 Vin 5 VZ 4 IZ Iload Rload Renbl KEY 0-500 W 2 Rboost Iboost 3 1.0 k TYP FB* A- *FB = MMZ2012 Y601B Figure 2. Typical Applications Circuit for Load Dump Transient Protection 15 "ENABLE NOT" INPUT 13.5 V SUPPLY RAIL DEVICE OUTPUT VOLTAGE LOAD DEPENDENT EXP DECAY 120 100 AMPLITUDE (V) 80 60 40 20 Voff 13.5 V SUPPLY RAIL Von LOAD DEPENDENT OUTPUT EXP DECAY TYPICAL INPUT TRANSIENT AMPLITUDE (V) 10 50% AMPLITUDE tpLH 5 0 0 5 10 15 30 20 25 TIME (ms) 35 40 45 50 0 0 50 100 150 200 TIME (ms) 250 300 350 Figure 3. Enable NOT Switching Waveforms Figure 4. Load Dump Waveforms http://onsemi.com 2 NCP3712ASNT1 ELECTRICAL CHARACTERISTICS (Vin = 12.5 VDC Ref to Gnd, TA = 25C unless otherwise noted.) Characteristic OFF CHARACTERISTICS Input-Output Breakdown Voltage (@ Iout = 200 mA) Output Reverse Breakdown Voltage (@ Iout = -1.0 mA Pulse) Output Leakage Current (Vin = Venbl = 30 V, TA = 25C) Guaranteed "Off" State "ENBL NOT" Voltage (IO 100 mA) Required "Off" State Iz Current (Rload = 100 W) Vin(off) (Vz = 16 V, Iload = 100 mA, Renbl = 1500 W) ON CHARACTERISTICS Input-Output On Voltage (Io = 100 mA, Ienbl = -3.0 mA) Output Load Current Continuous (Ienbl = -3.0 mA, Vio(on) = 0.5 Vdc) (Iboost = -9.0 mA, Vio(on) = 0.5 Vdc) (Iboost = -9.0 mA, Vio(on) = 0.6 Vdc) Vin(on) (Vz = 16 V, Iload = 100 mA, Renbl = 1500 W) "ENBL NOT" Input Current (Io = 100 mA, Vio(on) = 0.35 Vdc, Renbl = 1500 W) SWITCHING CHARACTERISTICS Propagation Delay Time: Hi to Lo Prop Delay; Fig. 3 (Vin = Venbl = 13.5 V) Lo to Hi Prop Delay; Fig. 3 (Vin = 13.5 V, Venbl = 0 V) Transition Times: Fall Time; Fig. 4 (Vin = Venbl = 13.5 V) Rise Time; Fig. 4 (Vin = Venbl = 0 V) INTERNAL RESISTORS Input Leakage Resistor Input Resistor Output Leakage Resistor Enable Input Resistor R2 R1 R4 R3 7.0 3.3 1.4 1.4 10 4.7 2.4 2.4 13 6.1 3.2 3.2 kW kW kW kW mS tPHL tPLH tf tr - - - - 1.5 1.5 75 400 - - hS - - Vio(on) - Io(on) - - - Von 8.5 Ienbl - - -1.0 - 10.5 mAdc - - - -200 -200 -300 Vdc 0.2 0.5 mAdc Vdc V(BRio) 105 V(-BRout) - Iload(off) - Venbl(off) 13 Iz(off) 150 Voff 15.5 - 18.7 - - Vdc - - mAdc - -100 Vdc -0.7 - mAdc - - Vdc Vdc Symbol Min Typ Max Unit http://onsemi.com 3 NCP3712ASNT1 PACKAGE DIMENSIONS TSOP-6 CASE 318G-02 ISSUE S D 6 5 1 2 4 3 HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS NOM MAX 1.00 1.10 0.06 0.10 0.38 0.50 0.18 0.26 3.00 3.10 1.50 1.70 0.95 1.05 0.40 0.60 2.75 3.00 10 - INCHES NOM 0.039 0.002 0.014 0.007 0.118 0.059 0.037 0.016 0.108 - b e q 0.05 (0.002) A1 A L c DIM A A1 b c D E e L HE q MIN 0.90 0.01 0.25 0.10 2.90 1.30 0.85 0.20 2.50 0 MIN 0.035 0.001 0.010 0.004 0.114 0.051 0.034 0.008 0.099 0 MAX 0.043 0.004 0.020 0.010 0.122 0.067 0.041 0.024 0.118 10 SOLDERING FOOTPRINT* 2.4 0.094 1.9 0.075 0.95 0.037 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 NCP3712ASNT1/D |
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